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Damien Broqua 2017-10-18 23:26:19 +02:00
parent 4074e0e973
commit 590a13f325
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Footprint/TSSOP-16.kicad_mod Normal file
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(module TSSOP-16 (layer F.Cu) (tedit 56DED843)
(descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0.127 -3.556) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value >NAME (at -0.1016 3.683) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -2.2225 -3.175) (end -2.3495 -3.302) (layer F.SilkS) (width 0.15))
(fp_line (start -1.905 -2.794) (end -1.905 2.794) (layer F.SilkS) (width 0.15))
(fp_line (start 1.905 -2.8) (end 1.905 2.8) (layer F.SilkS) (width 0.15))
(fp_line (start -1.905 -2.8) (end 1.905 -2.8) (layer F.SilkS) (width 0.15))
(fp_line (start -1.905 2.8) (end 1.905 2.8) (layer F.SilkS) (width 0.15))
(fp_circle (center -1.3335 -2.2225) (end -1.4605 -2.3495) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask))
(model Housings_SSOP.3dshapes/TSSOP-16_4.4x5mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)